When thinking about sugar wafers and extruded snacks, the Hebenstreit booth is a “must see” stop again this year. After all, Hebenstreit is an idea factory. Some of the company’s ideas have set standards in the industry, such as the baking plate size of 700 x 350 mm, the unique vertical plate locking technology, the lowest oven CO2 emissions as well as lowest energy consumption to name a few.
The company is a global manufacturer of sugar wafer and extruded snack food production lines. All equipment is designed and built in its two manufacturing plants in Germany.
During interpack, Hebenstreit will be presenting its next idea and the next standard in wafer production technology. Visitors will see a baking plate with a dimension of up to 1,000 x 350 mm. This technology provides the highest capacity and efficiency within a minimum floor space.
The company has also developed a system of automatically fully opening and closing the baking plates at the rear of the oven and then using a laser system to quickly and efficiently clean the plates. This method allows for a complete oven to be cleaned in a single shift.
Hebenstreit also recognizes that a good quality wafer starts with a good quality batter and cream filling. Fully automatic batter and cream preparation systems with the feeding and dosing of the raw materials are part of its equipment range. The batter mixers can also be provided with the proven Tecon technology, which is based on the concept that the mixer is mounted on load cells for improved performance.
For more information, visit www.hebenstreit.de; at interpack stop by booth E08 in hall 3