Pack Expo 2012: Windy City Whirlwind
Pack Expo 2012 in Chicago provides attendees with a candy-centric approach to finding the latest technologies.
Bosch Packaging Technology
At Pack Expo, Bosch Packaging Technology will introduce the bar packaging line to the American market. The system consists of the distribution station Sigpack DCI, the horizontal flow-wrapper Sigpack HRM with high-performance splice and the new toploader Sigpack TTM.
Designed with operational optimization in mind, the bar packaging line addresses key requirements of bar producers, from speed and hygiene to ease of operation, flexibility and efficiency.
For more information, visit www.boschpackaging.com or stop by booth S-2212.